Display device

ABSTRACT

A display device includes: a display panel in which a non-display region and a display region surrounding the non-display region are defined, wherein the display panel includes: a base layer comprising a first region in which a hole is defined corresponding to the non-display region, a second region surrounding the first region, and a third region corresponding to the display region; and first signal line parts disposed on the second region and the third region, the first signal line parts arrayed spaced apart from each other in a first direction, and each of the first signal line parts includes: a first line; a second line spaced apart from the first line; and a first connection part configured to connect the first line and the second line.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a Continuation of U.S. patent application Ser. No.16/688,551, filed Nov. 19, 2019, which claims priority from and thebenefit of Korean Patent Application No. 10-2018-0152681, filed on Nov.30, 2018, which is hereby incorporated by reference for all purposes asif fully set forth herein.

BACKGROUND Field

Exemplary implementations of the invention relate generally to a displaydevice, and more particularly, to a display device having improveddisplay quality and provided with an electronic module having improvedsensitivity.

Discussion of the Background

Display devices may be devices each including a display panel fordisplaying an image, an input sensing member for sensing an externalinput, and various electronic components such as an electronic module.Electronic components may be electrically connected to each other viavariously arranged signal lines. The display panel includes alight-emitting element that generates an image. The input sensing membermay include sensing electrodes for sensing external inputs. Theelectronic modules may include a camera, an infrared sensing sensor, aproximity sensor, etc. The electronic module may be disposed under thedisplay panel.

The above information disclosed in this Background section is only forunderstanding of the background of the inventive concepts, and,therefore, it may contain information that does not constitute priorart.

SUMMARY

Devices constructed according to exemplary embodiments of the inventionprovide a display device provided with an electronic module havingimproved sensitivity and improved display quality.

Additional features of the inventive concepts will be set forth in thedescription which follows, and in part will be apparent from thedescription, or may be learned by practice of the inventive concepts.

According to one or more exemplary embodiments of the invention, adisplay device includes: a base layer including a first region, a secondregion surrounding the first region, and a third region surrounding thesecond region; first signal line parts disposed on the second region andthe third region and arranged spaced apart from each other in a firstdirection; second signal line parts disposed on the second region andthe third region and arranged spaced apart from each other in a seconddirection crossing the first direction; and pixels disposed on the thirdregion and electrically connected to one first signal line part amongthe first signal line parts, wherein each of the first signal line partsincludes: a first line; a second line spaced apart from the first line;and a first connection part configured to connect the first line and thesecond line, and at least a portion of the first connection parts of thefirst signal line parts overlaps at least a portion of the second signalline parts.

The display device may further include an electronic module disposed tooverlap the first region when viewed in a plan view.

The first line and the second line may be disposed on the same layer,and the first connection part may be disposed on a layer different fromthat of the first line and the second line.

The first line and the second line may be disposed on layers differentfrom each other, and the first connection part may be disposed on thesame layer as one of the first line and the second line.

The first connection parts may be divided into an overlapped connectionpart and a non-overlapped connection part, the overlapped connectionpart may overlap at least the portion of the second signal line parts,and the non-overlapped connection part may not overlap the second signalline parts.

The overlapped connection part may be disposed on the second region, andthe non-overlapped connection part may be disposed on the third region.

The overlapped connection part may include a plurality of overlappedconnection parts, the non-overlapped connection part may include aplurality of non-overlapped connection parts, the plurality ofoverlapped connection parts may be arranged spaced apart from each otherin the first direction, and the plurality of non-overlapped connectionparts may be arranged spaced apart from each other in the firstdirection.

The overlapped connection part may include a plurality of overlappedconnection parts, and two adjacent overlapped connection parts among theplurality of overlapped connection parts may not overlap each other whenviewed in the first direction.

The overlapped connection part may include a plurality of overlappedconnection parts, one portion of each of two most adjacent overlappedconnection parts to each other among the plurality of overlappedconnection parts may not overlap each other when viewed in the firstdirection, and a remaining portion of the two most adjacent overlappedconnection parts to each other may overlap each other in the firstdirection.

The first line may be disposed on the second region, a portion of thefirst line may extend corresponding to a shape of a boundary between thefirst region and the second region, and the second line may extend inthe second direction.

The first connection part may be connected to at least one of the firstline and the second line through a through hole defined in an insulatinglayer configured to cover at least one of the first line and the secondline.

Each of the second signal line parts may include: a third line; a fourthline spaced apart from the third line; and a second connection partconfigured to connect the third line and the fourth line, and at least aportion of the second connection parts of the second signal line partsmay overlap at least a portion of the first signal line parts.

The third line may be disposed on the second region, at least a portionof the third line may extend corresponding to a shape of a boundarybetween the first region and the second region, the fourth line mayextend in the first direction, and a second connection part may beconnected to at least one of the third line and the fourth line througha through hole defined in an insulating layer configured to cover atleast one of the third line and the fourth line.

A hole may be defined in the first region of the base layer, and thehole may be surrounded by the second region when viewed in a plan view.

The base layer, the first signal line parts, the second signal lineparts, and the pixels constitute a display module; a first module regionoverlapping the first region, a second module region overlapping thesecond region, and a third module region overlapping the third regionmay be defined in the display module; and a transmittance of the firstmodule region may be higher than that of the third module region.

According to one or more exemplary embodiments of the invention, adisplay device includes: a display panel in which a non-display regionand a display region surrounding the non-display region are defined,wherein the display panel includes: a base layer comprising a firstregion in which a hole is defined corresponding to the non-displayregion, a second region surrounding the first region, and a third regioncorresponding to the display region; and first signal line partsdisposed on the second region and the third region, the first signalline parts arrayed spaced apart from each other in a first direction,and each of the first signal line parts includes: a first line; a secondline spaced apart from the first line; and a first connection partconfigured to connect the first line and the second line.

The first connection part may be disposed to overlap the second region.

The first connection parts of the first signal line parts may bearranged spaced apart from each other in the first direction.

Two adjacent first connection parts may not overlap each other in thefirst direction.

The display device may further include second signal line parts arrangedspaced apart from each other in a second direction crossing the firstdirection, wherein each of the second signal line parts may include: athird line; a fourth line spaced apart from the third line; and a secondconnection part configured to connect the third line and the fourthline.

It is to be understood that both the foregoing general description andthe following detailed description are exemplary and explanatory and areintended to provide further explanation of the invention as claimed.

BRIEF DESCRIPTION OF THE FIGURES

The accompanying drawings, which are included to provide a furtherunderstanding of the invention and are incorporated in and constitute apart of this specification, illustrate exemplary embodiments of theinvention, and together with the description serve to explain theinventive concepts.

FIG. 1A is a perspective view of a display device according to anexemplary embodiment.

FIG. 1B is an exploded perspective view of a display device according toan exemplary embodiment.

FIG. 2 is a block diagram of a display device according to an exemplaryembodiment.

FIG. 3 is a plan view of a display panel according to an exemplaryembodiment.

FIG. 4 is a plan view of an input sensing part according to an exemplaryembodiment.

FIG. 5 is a cross-sectional view of a display panel according to anexemplary embodiment.

FIG. 6 is a cross-sectional view of a display panel according to anexemplary embodiment.

FIG. 7 is a cross-sectional view of a display panel according to anexemplary embodiment.

FIG. 8 is an enlarged plan view showing region XX′ shown in FIG. 3.

FIG. 9 is a view of a captured image of a region corresponding to regionYY′ shown in FIG. 8.

FIG. 10 is a schematic plan view of a region corresponding to region ZZ′shown in FIG. 9.

FIG. 11 is a cross-sectional view taken along a sectional line I-I′ ofFIG. 10.

FIG. 12 is a cross-sectional view taken along a sectional line II-II′ ofFIG. 10.

FIG. 13 is an enlarged schematic plan view of region KK′ shown in FIG.8.

FIG. 14 is a cross-sectional view taken along a sectional line III-III′of FIG. 13.

FIG. 15 is a view of a captured image of a region corresponding to theregion YY′ shown in FIG. 8.

FIG. 16 is a schematic plan view of a region corresponding to region LL′shown in FIG. 15.

FIG. 17 is an enlarged plan view showing the region XX′ shown in FIG. 3.

FIG. 18 is a view of a captured image of a region corresponding toregion MM′ shown in FIG. 17.

FIG. 19 is a schematic plan view of a region corresponding to region NN′shown in FIG. 18.

FIG. 20 is an exploded perspective view of a display device according toan exemplary embodiment.

DETAILED DESCRIPTION

In the following description, for the purposes of explanation, numerousspecific details are set forth in order to provide a thoroughunderstanding of various exemplary embodiments or implementations of theinvention. As used herein “embodiments” and “implementations” areinterchangeable words that are non-limiting examples of devices ormethods employing one or more of the inventive concepts disclosedherein. It is apparent, however, that various exemplary embodiments maybe practiced without these specific details or with one or moreequivalent arrangements. In other instances, well-known structures anddevices are shown in block diagram form in order to avoid unnecessarilyobscuring various exemplary embodiments. Further, various exemplaryembodiments may be different, but do not have to be exclusive. Forexample, specific shapes, configurations, and characteristics of anexemplary embodiment may be used or implemented in another exemplaryembodiment without departing from the inventive concepts.

Unless otherwise specified, the illustrated exemplary embodiments are tobe understood as providing exemplary features of varying detail of someways in which the inventive concepts may be implemented in practice.Therefore, unless otherwise specified, the features, components,modules, layers, films, panels, regions, and/or aspects, etc.(hereinafter individually or collectively referred to as “elements”), ofthe various embodiments may be otherwise combined, separated,interchanged, and/or rearranged without departing from the inventiveconcepts.

The use of cross-hatching and/or shading in the accompanying drawings isgenerally provided to clarify boundaries between adjacent elements. Assuch, neither the presence nor the absence of cross-hatching or shadingconveys or indicates any preference or requirement for particularmaterials, material properties, dimensions, proportions, commonalitiesbetween illustrated elements, and/or any other characteristic,attribute, property, etc., of the elements, unless specified. Further,in the accompanying drawings, the size and relative sizes of elementsmay be exaggerated for clarity and/or descriptive purposes. When anexemplary embodiment may be implemented differently, a specific processorder may be performed differently from the described order. Forexample, two consecutively described processes may be performedsubstantially at the same time or performed in an order opposite to thedescribed order. Also, like reference numerals denote like elements.

When an element, such as a layer, is referred to as being “on,”“connected to,” or “coupled to” another element or layer, it may bedirectly on, connected to, or coupled to the other element or layer orintervening elements or layers may be present. When, however, an elementor layer is referred to as being “directly on,” “directly connected to,”or “directly coupled to” another element or layer, there are nointervening elements or layers present. To this end, the term“connected” may refer to physical, electrical, and/or fluid connection,with or without intervening elements. Further, a DR1-axis, a DR2-axis,and a DR3-axis are not limited to three axes of a rectangular coordinatesystem, such as the x, y, and z-axes, and may be interpreted in abroader sense. For example, the DR1-axis, the DR2-axis, and the DR3-axismay be perpendicular to one another, or may represent differentdirections that are not perpendicular to one another. For the purposesof this disclosure, “at least one of X, Y, and Z” and “at least oneselected from the group consisting of X, Y, and Z” may be construed as Xonly, Y only, Z only, or any combination of two or more of X, Y, and Z,such as, for instance, XYZ, XYY, YZ, and ZZ. As used herein, the term“and/or” includes any and all combinations of one or more of theassociated listed items.

Although the terms “first,” “second,” etc. may be used herein todescribe various types of elements, these elements should not be limitedby these terms. These terms are used to distinguish one element fromanother element. Thus, a first element discussed below could be termed asecond element without departing from the teachings of the disclosure.

Spatially relative terms, such as “beneath,” “below,” “under,” “lower,”“above,” “upper,” “over,” “higher,” “side” (e.g., as in “sidewall”), andthe like, may be used herein for descriptive purposes, and, thereby, todescribe one elements relationship to another element(s) as illustratedin the drawings. Spatially relative terms are intended to encompassdifferent orientations of an apparatus in use, operation, and/ormanufacture in addition to the orientation depicted in the drawings. Forexample, if the apparatus in the drawings is turned over, elementsdescribed as “below” or “beneath” other elements or features would thenbe oriented “above” the other elements or features. Thus, the exemplaryterm “below” can encompass both an orientation of above and below.Furthermore, the apparatus may be otherwise oriented (e.g., rotated 90degrees or at other orientations), and, as such, the spatially relativedescriptors used herein interpreted accordingly.

The terminology used herein is for the purpose of describing particularembodiments and is not intended to be limiting. As used herein, thesingular forms, “a,” “an,” and “the” are intended to include the pluralforms as well, unless the context clearly indicates otherwise. Moreover,the terms “comprises,” “comprising,” “includes,” and/or “including,”when used in this specification, specify the presence of statedfeatures, integers, steps, operations, elements, components, and/orgroups thereof, but do not preclude the presence or addition of one ormore other features, integers, steps, operations, elements, components,and/or groups thereof. It is also noted that, as used herein, the terms“substantially,” “about,” and other similar terms, are used as terms ofapproximation and not as terms of degree, and, as such, are utilized toaccount for inherent deviations in measured, calculated, and/or providedvalues that would be recognized by one of ordinary skill in the art.

Various exemplary embodiments are described herein with reference tosectional and/or exploded illustrations that are schematic illustrationsof idealized exemplary embodiments and/or intermediate structures. Assuch, variations from the shapes of the illustrations as a result, forexample, of manufacturing techniques and/or tolerances, are to beexpected. Thus, exemplary embodiments disclosed herein should notnecessarily be construed as limited to the particular illustrated shapesof regions, but are to include deviations in shapes that result from,for instance, manufacturing. In this manner, regions illustrated in thedrawings may be schematic in nature and the shapes of these regions maynot reflect actual shapes of regions of a device and, as such, are notnecessarily intended to be limiting.

As customary in the field, some exemplary embodiments are described andillustrated in the accompanying drawings in terms of functional blocks,units, and/or modules. Those skilled in the art will appreciate thatthese blocks, units, and/or modules are physically implemented byelectronic (or optical) circuits, such as logic circuits, discretecomponents, microprocessors, hard-wired circuits, memory elements,wiring connections, and the like, which may be formed usingsemiconductor-based fabrication techniques or other manufacturingtechnologies. In the case of the blocks, units, and/or modules beingimplemented by microprocessors or other similar hardware, they may beprogrammed and controlled using software (e.g., microcode) to performvarious functions discussed herein and may optionally be driven byfirmware and/or software. It is also contemplated that each block, unit,and/or module may be implemented by dedicated hardware, or as acombination of dedicated hardware to perform some functions and aprocessor (e.g., one or more programmed microprocessors and associatedcircuitry) to perform other functions. Also, each block, unit, and/ormodule of some exemplary embodiments may be physically separated intotwo or more interacting and discrete blocks, units, and/or moduleswithout departing from the scope of the inventive concepts. Further, theblocks, units, and/or modules of some exemplary embodiments may bephysically combined into more complex blocks, units, and/or moduleswithout departing from the scope of the inventive concepts.

Unless otherwise defined, all terms (including technical and scientificterms) used herein have the same meaning as commonly understood by oneof ordinary skill in the art to which this disclosure is a part. Terms,such as those defined in commonly used dictionaries, should beinterpreted as having a meaning that is consistent with their meaning inthe context of the relevant art and should not be interpreted in anidealized or overly formal sense, unless expressly so defined herein.

Hereinafter, exemplary embodiments of the inventive concepts will bedescribed with reference to the accompanying drawings.

FIG. 1A is a perspective view of a display device according to anexemplary embodiment. FIG. 1B is an exploded perspective view of adisplay device according to an exemplary embodiment. FIG. 2 is a blockdiagram of a display device according to an exemplary embodiment.Hereinafter, referring to FIGS. 1A, 1B, and 2, an exemplary embodimentwill be described.

A display device EA may be a device activated in response to anelectrical signal. The display device EA may include various examples.For example, the display device EA may include a tablet PC, a laptop PC,a television, etc. In this embodiment, the display device EA isexemplarily illustrated as a smartphone.

The display device EA may display an image IM in a third direction DR3on a display surface FS which is parallel to each of a first directionDR1 and a second direction DR2. The display surface FS on which theimage IM is displayed may correspond to the front surface of the displaydevice EA and may correspond to a front surface FS of a window 100.Hereinafter, the display surface and the front surface of the displaydevice EA, and the front surface of the window 100 will be referred bythe same reference symbols. The image IM may include not only movingimages but also static images. FIG. 1A illustrates a clock window andapplication icons as examples of the image IM.

In this embodiment, front surface (or upper surface) and rear surface(or lower surface) of each member is defined with respect to thedirection in which the image WI is displayed. The front surface and therear surface may be opposite to each other in the third direction DR3,and the normal direction of each of the front surface and the rearsurface may be parallel to the third direction DR3. Meanwhile, thedirections indicated by the first to third directions DR1, DR2, and DR3are relative and may be converted into other directions. Hereinafter,the first to third directions are directions, which the first to thirddirection DR1, DR2, and DR3 respectively indicate, and referred to bythe same reference symbols.

The display device EA may include a window 100, a display module 200, adrive circuit part 300, a housing 400, and an electronic module 500. Inthis embodiment, the window 100 and the housing 400 may be coupled andconstitute the external appearance of the display device EA.

The window 100 may include an optically transparent insulating material.For example, the window 100 may include glass or plastic. The window 100may have a multilayer structure or single layer structure. For example,the window 100 may include a plurality of plastic films coupled by meansof an adhesive, or may include a glass substrate and a plastic filmwhich are coupled by means of an adhesive.

The window 100 may be divided into a transmissive region TA and a bezelregion BA when viewed in a plan view. In this specification, the wording“on a plane” may mean a case of viewing in the third direction DR3. Inaddition, the “thickness direction” may be the third direction DR3.

The transmissive region TA may be an optically transparent region. Thebezel region BZA may be a region having a relatively lower lighttransmittance than the transmissive region TA. The bezel region BZA maydefine the shape of the transmissive region TA. The bezel region BZA maybe adjacent to the transmissive region TA and surround the transmissiveregion TA.

The bezel region BZA may have a predetermined color. The bezel regionBZA may cover a peripheral region NAA of the display module 200 andprevent or suppress the peripheral region NAA from being viewed from theoutside. Meanwhile, this is exemplarily illustrated, and in the window100 according to an exemplary embodiment, the bezel region BZA may beomitted.

In an exemplary embodiment, a sensing region SA may be a regionoverlapping the electronic module 500 to be described later. The displaydevice EA may receive an external signal required for the electronicmodule 500 through the sensing region SA or provide a signal output fromthe electronic module 500 to the outside. According to the exemplaryembodiment, the sensing region SA may be defined to overlap thetransmissive region TA. Accordingly, a separate region, which isprovided to provide the sensing region SA in a region other than thetransmissive region TA, may be omitted. Thus, the area of the bezelregion BZA may be reduced.

FIG. 1B exemplarily illustrates that the number of sensing regions SA isone, but the exemplary embodiments are not limited thereto. For example,two or more sensing regions SA may be defined. In addition, FIG. 1Bexemplarily illustrates that the sensing region SA is defined on anupper left end of the transmissive region TA, but the sensing region SAmay be defined on various regions, such as, on the upper right end ofthe transmissive region TA, on the central portion of the transmissiveregion TA, on the lower left end of the transmissive region TA, or thelower right end of the transmissive region TA.

The display module 200 may be disposed under the window 100. In thisspecification, the wording “under” may mean the opposite direction ofthe direction in which the display module 200 provides an image. Thedisplay module 200 may display an image IM and detect an external inputTC. The display module 200 includes a front surface (also referred to asdisplay surface) IS including an active region AA and a peripheralregion NAA. The active region AA may be a region which is activated inresponse to an electrical signal.

In this embodiment, the active region AA may be a region on which animage IM is displayed, and an external input TC is detected. Thetransmissive region TA overlaps at least the active region AA. Forexample, the transmissive region TA overlaps the entirety of or aportion of the active region AA. Accordingly, a user may view an imageIM through the transmissive region TA, or provide an external input TC.

The peripheral region NAA may be a region covered by the bezel regionBZA. The peripheral region NAA is adjacent to the active region AA. Theperipheral region NAA may surround the active region AA. In theperipheral region NAA, a drive circuit, drive wiring, or the like whichare for driving the active region AA may be disposed.

In this embodiment, the display module 200 is assembled in a flat statein which the active region AA and the peripheral region NAA face thewindow 100. However, this is exemplarily illustrated, and a portion ofthe peripheral region NAA may be bent. At this point, a portion of theperipheral region NAA faces the rear surface of the display device EA,so that the area of the bezel region BZA may be reduced on the frontsurface of the display device EA. Alternatively, the display module 200may also be assembled in a state in which a portion of the active regionAA is also bent. Alternatively, in the display module 200 according toan exemplary embodiment, the peripheral region NAA may be omitted.

The display module 200 may include a display panel 210 and an inputsensing unit 220.

The display panel 210 may be a component which actually generates animage IM. The image IM generated by the display panel 210 is displayedon the display surface IS, and is viewed by a user from the outsidethrough the transmissive region TA.

The input sensing unit 220 detects the external input TC applied fromthe outside. For example, the input sensing unit 220 may detect theexternal input TC provided to the window 100. The external input TC maybe an input from a user. User's input includes various types of externalinputs, such as a portion of user's body, light, heat, pen or pressure.In this embodiment, the external input TC is illustrated as user's handapplied on the front surface FS. However, this is exemplarilyillustrated, and as described above, user's input may be provided invarious forms, and the display device EA may also detect user's externalinput TC applied to a side surface or the rear surface of the displaydevice EA according to the structure of the display device EA, and theexemplary embodiments are not limited to any one embodiment.

The drive circuit part 300 may be electrically connected to the displaypanel 210 and the input sensing unit 220. The drive circuit part 300 mayinclude a main circuit board MB, a first flexible film CF1, and a secondflexible film CF2.

The first flexible film CF1 may be electrically connected to the displaypanel 210. The first flexible film CF1 may connect the display panel 210and the main circuit board MB. The first flexible film CF1 may beconnected to pads (display pads) of the display panel 210 disposed onthe peripheral region NAA. The first flexible film CF1 provides thedisplay panel 210 with an electrical signal for driving the displaypanel 210. The electrical signal may be generated from the firstflexible film CF1 or the main circuit board MB.

The second flexible film CF2 may be electrically connected to the inputsensing unit 220. The second flexible film CF2 may connect the inputsensing unit 220 and the main circuit board MB. The second flexible filmCF2 may be connected to pads (sensing pads) of the input sensing unit220 disposed on the peripheral region NAA. The second flexible film CF2provides the input sensing unit 220 with an electrical signal fordriving the input sensing unit 220. The electrical signal may begenerated from the second flexible film CF2 or the main circuit boardMB.

The main circuit board MB may include various drive circuits for drivingthe display module 200, a connector for power supply, etc. The firstflexible film CF1 and the second flexible film CF2 may be connected tothe main circuit board MB. According to exemplary embodiments of theinventive concepts, the display module 200 may easily be controlledthrough the one main circuit board MB. However, this is exemplarilyillustrated, in the display module 200 according to an exemplaryembodiment, the display panel 210 and the input sensing unit 220 mayalso be connected to the main circuit boards different from each other,and either the first flexible film CF1 or the second flexible film CF2may not be connected to the main circuit board MB, and the exemplaryembodiments are not limited any one embodiment.

In an exemplary embodiment, one region corresponding to the sensingregion SA in the display module 200 may have a relatively highertransmittance than the active region AA which does not overlap thesensing region SA. For example, at least a portion of the components ofthe display panel 210 and the input sensing unit 220 may be removed.Accordingly, the electronic module 500 which is disposed to overlap thesensing region SA may easily transmit and/or receive a signal throughthe sensing region SA.

FIG. 1B exemplarily illustrates that a predetermined hole MH(hereinafter referred to as a module hole) is defined in one region ofthe display module 200 corresponding to the sensing region SA. Themodule hole MH may be defined in the active region AA and pass throughthe display module 200. The display panel 210 and the input sensing unit220 may be passed through by the module hole MH. That is, the modulehole MH may be defined such that all the components of the display panel210 and the input sensing unit 220 disposed to overlap the sensingregion SA are removed. Since the module hole MH is defined in the activeregion AA, the sensing region SA may be provided within the transmissiveregion TA.

When viewed in a plan view, the electronic module 500 may overlap themodule hole MH and the sensing region SA. The electronic module 500 maybe disposed under the display module 200 and at least a portion of theelectronic module 500 may also be accommodated inside the module holeMH. The electronic module 500 may receive an external input transmittedthrough the sensing region SA or provide an output through the sensingregion SA.

The housing 400 is coupled to the window 100. The housing 400 is coupledto the window 100 to thereby provide an inner space. The display module200 and the electronic module 500 may be accommodated in the innerspace.

The housing 400 may include a material having relatively high stiffness.For example, the housing 400 may include glass, plastic, or metal, orinclude a plurality of frames and/or plates composed of combinationsthereof. The housing 400 may stably protect the components of thedisplay device EA accommodated in the inner space from external shocks.

Referring to FIG. 2, a display device EA may include a display module200, a power supply module PM, a first electronic module EM1, and asecond electronic module EM2. The display module 200, the power supplymodule PM, the first electronic module EM1, and the second electronicmodule EM2 may be electrically connected to each other.

The power supply module PM supplies power required for overalloperations of the display device EA. The power supply module PM mayinclude a normal battery module.

The first electronic module EM1 and the second electronic module EM2 mayinclude various functional modules for operating the display device EA.

The first electronic module EM1 may be directly mounted on a motherboard electrically connected to the display module 200, or be mounted ona separate board and electrically connected to the mother board througha connector or the like.

The first electronic module EM1 may include a control module CM, awireless communication module TM, an image input module IM, an audioinput module AIM, a memory MM, and an external interface IF. Some of themodules may not be mounted on the mother board, but may also beelectrically connected to the mother board through a flexible circuitboard.

The control module CM controls the overall operations of the displaydevice EA. The control module CM may be a microprocessor. For example,the control module CM may activate or deactivate the display module 200.The control module CM may control other modules such as the image inputmodule IM or the audio input module AIM on the basis of a touch signalreceived from the display module 200.

The wireless communication module TM may transmit/receive a wirelesssignal to/from another terminal using a Bluetooth or WiFi line. Thewireless communication module TM may transmit/receive an audio signalusing a general communication line. The wireless communication module TMmay include a transmission unit TM1 which modulates and transmits asignal to be transmitted and a receiving unit TM2 which demodulates areceived signal.

The image input module IM processes an image signal and converts theimage signal into image data which may be displayed on the displaymodule 200. The audio input module AIM receives an external audio signalthrough a microphone in a recording mode, a voice recognition mode,etc., and converts the audio signal into an electrical voice data.

The external interface IF may function as an interface connected to anexternal charger, a wired/wireless data port, a card (for example,memory card or SIM/UIIVI card), socket or the like.

The second electronic module EM2 may include an audio output module AOM,a light-emitting module LM, a light-receiving module LRM, a cameramodule CMM, and the like. The components may be directly mounted on themother board, be mounted on a separate board and electrically connectedto the display module 200 through a connector or the like, or beelectrically connected to the first electronic module EM1.

The audio output module AOM converts audio data received from thewireless communication module TM or audio data stored in the memory MMand outputs the converted audio data to the outside.

The light-emitting module LM generates and outputs light. Thelight-emitting module LM may output an infrared ray. The light-emittingmodule LM may include an LED element. The light-receiving module LRM maydetect an infrared ray. The light-receiving module LRM may be activatedwhen an infrared ray of at least a predetermined level is detected. Thelight-receiving module LRM may include a CMOS sensor. After the infraredlight generated from the light-emitting module LM is output, theinfrared ray is reflected from an external object (for example, user'sfinger or face), and the reflected infrared ray may be incident on thelight-receiving module LRM. The camera module CMM may capture an imageof the outside.

The electronic module 500 according to an exemplary embodiment mayinclude at least any one of the components of the first electronicmodule EM1 or the second electronic module EM2. For example, theelectronic module 500 may include at least any one of an audio outputmodule AOM, a light-emitting module LM, a light-receiving module LRM, acamera module CMM, a heat sensing module or the like. The electronicmodule 500 may detect an external subject received through the sensingregion SA, or provide an audio signal, such as voice, or light, such asan infrared ray, to the outside. In addition, the electronic module 500may also include a plurality of modules, and the exemplary embodimentsare not limited to any one embodiment.

In exemplary embodiments, the display module 200, the first electronicmodule EM1, the second electronic module EM2, the power supply modulePM, and/or one or more components thereof, may be implemented via one ormore general purpose and/or special purpose components, such as one ormore discrete circuits, digital signal processing chips, integratedcircuits, application specific integrated circuits, microprocessors,processors, programmable arrays, field programmable arrays, instructionset processors, and/or the like.

According to one or more exemplary embodiments, the features, functions,processes, etc., described herein may be implemented via software,hardware (e.g., general processor, digital signal processing (DSP) chip,an application specific integrated circuit (ASIC), field programmablegate arrays (FPGAs), etc.), firmware, or a combination thereof In thismanner, the display module 200, the first electronic module EM1, thesecond electronic module EM2, the power supply module PM, and/or one ormore components thereof may include or otherwise be associated with oneor more memories including code (e.g., instructions) configured to causethe display module 200, the first electronic module EM1, the secondelectronic module EM2, the power supply module PM, and/or one or morecomponents thereof to perform one or more of the features, functions,processes, etc., described herein.

The memories may be any medium that participates in providing code tothe one or more software, hardware, and/or firmware components forexecution. Such memories may be implemented in any suitable form,including, but not limited to, non-volatile media, volatile media, andtransmission media. Non-volatile media include, for example, optical ormagnetic disks. Volatile media include dynamic memory. Transmissionmedia include coaxial cables, copper wire and fiber optics. Transmissionmedia can also take the form of acoustic, optical, or electromagneticwaves. Common forms of computer-readable media include, for example, afloppy disk, a flexible disk, hard disk, magnetic tape, any othermagnetic medium, a compact disk-read only memory (CD-ROM), a rewriteablecompact disk (CD-RW), a digital video disk (DVD), a rewriteable DVD(DVD-RW), any other optical medium, punch cards, paper tape, opticalmark sheets, any other physical medium with patterns of holes or otheroptically recognizable indicia, a random-access memory (RAM), aprogrammable read only memory (PROM), and erasable programmable readonly memory (EPROM), a FLASH-EPROM, any other memory chip or cartridge,a carrier wave, or any other medium from which information may be readby, for example, a controller/processor.

FIG. 3 is a plan view of a display panel according to an exemplaryembodiment.

Referring to FIG. 3, the display panel 210 may include a base layer BS,a plurality of pixels PX, a plurality of signal lines GL, DL, and PL,and a plurality of display pads PDD.

An active region AA of the display panel 210 is a region on which animage is displayed, and a peripheral region NAA may be a region on whicha drive circuit, drive lines, or the like are disposed. FIG. 3illustrates the active region AA and the peripheral region NAA of thedisplay panel 210. A plurality of pixels PX may be disposed in theactive region AA.

The base layer BS may be a laminated structure including a siliconsubstrate, a plastic substrate, a glass substrate, an insulating film ora plurality of insulating layers.

The base layer BS may include a first region AR1, a second region AR2,and a third region AR3. When viewed in a plan view, the second regionAR2 may surround the first region AR1, and the third region AR3 maysurround the second region AR2. The first region AR1, the second regionAR2, and the third region AR3 may be surrounded by the peripheral regionNAA. The plurality of pixels PX may be disposed on the third region AR3.That is, the third region AR3 may correspond to the active region AA.

At least a portion of the first region AR1 may be a region overlapping asensing region SA when viewed in a plan view. A module hole MH may bedefined in at least the portion of the first region AR1. That is, thecomponents of the display panel 210 may be removed from the regioncorresponding to the sensing region SA, or may be disposed so as not tooverlap the sensing region SA. When viewed in a plan view, the firstregion AR1 may surround the module hole MH. On the first region AR1, astructure, such as a groove part or a dam part, for blocking apenetration path of external moisture of oxygen may be disposed, andthis will be described later.

The pixels PX which provide an image may not be disposed on the firstregion AR1 and the second region AR2 of the base layer BS. Accordingly,in the display panel 210, the region including the first region AR1 andthe second region AR2 of the base layer BS may be defined as anon-display region. The plurality of pixels PX may be disposed on thethird region AR3 of the base layer BS. Accordingly, the region includingthe third region AR3 of the base layer BS may be defined as a displayregion. That is, the display region of the display panel 210 maycorrespond to the third region AR3 of the base layer BS, and thenon-display region of the display panel 210 may correspond to the firstregion AR1 and the second region AR2 of the base layer BS.

According to an exemplary embodiment, the non-display region surroundedby the display region may be disposed when viewed in a plan view. Thenon-display region may be a region overlapping the electronic module 500(see FIG. 1B). Accordingly, a separate region provided for providingsensing regions on the outer periphery of the display region may beomitted, and thus, the area of the bezel region may be reduced. Thebezel region may mean the region surrounding the display region.

The plurality of signal lines GL, DL, and PL are connected to the pixelsPX, and electrical signals are transmitted to the pixels PX. Among thesignal lines included in the display panel 210, scan lines GL, datalines DL, and power supply lines(hereinafter, also referred to as powerlines) PL are exemplarily illustrated. However, this is exemplarilyillustrated, and the signal lines GL, DL, and PL may also include atleast any one of initial voltage lines, light-emitting lines, and theexemplary embodiments are not limited to any one embodiment.

The plurality of signal lines GL, DL, and PL may be disposed on thesecond region AR2 and the third region AR3. The plurality of signallines GL, DL, and PL may not be disposed on the first region AR1.

In this embodiment, an equivalent circuit diagram of a single pixel PXamong the plurality of pixels PX is enlarged and exemplarilyillustrated. The pixel PX may include a first transistor TR1, acapacitor CP, a second transistor TR2, and a light-emitting element ELD.The first transistor TR1 may be a switching element which controlson-off of the pixel PX. The first transistor TR1 may respond to a scansignal transmitted through a scan line GL and transmit or block a datasignal transmitted through a data line DL.

The capacitor CP is connected to the first transistor TR1 and the powerline PL. The capacitor CP charges an amount of charges corresponding tothe difference between the data signal transmitted from the firsttransistor TR1 and afirst power supply signal applied to the power linePL.

The second transistor TR2 is connected to the first transistor TR1, thecapacitor CP, and the light-emitting element ELD. The second transistorTR2 controls a drive current flowing through the light-emitting elementELD corresponding to an amount of charges stored in the capacitor CP.According to the amount of charges charged to the capacitor CP, theturn-on time of the second transistor TR2 may be determined. The secondtransistor TR2 provides the light-emitting element ELD with a firstpower supply signal transmitted through the power supply line PL duringthe turn-on time.

The light-emitting element ELD may generate light in response to anelectrical signal and control an amount of light. For example, thelight-emitting element ELD may include an organic light-emitting elementor a quantum dot light-emitting element.

The light-emitting element ELD is connected to a power supply terminalVSS and receives a power supply signal (hereinafter, referred to as asecond power supply signal) different from the first power supply signalprovided through the power line PL. A drive current, corresponding tothe difference between the first power supply signal provided from thesecond transistor TR2 and the second power supply signal, flows throughthe light-emitting element ELD, and the light-emitting element ELD maygenerate light corresponding to the drive current. Meanwhile, this isexemplarily illustrated, and the pixel PX may include electronicelements having various configurations and arrays, and the exemplaryembodiments are not limited to any one embodiment.

The power supply pattern VDD is disposed on the peripheral region NAA.In this embodiment, the power supply pattern VDD is connected to theplurality of power supply lines PL. Accordingly, the display panel 210includes the power supply pattern VDD and may thereby provide theplurality of pixels with the substantially the same first power supplysignal.

The display pads PDD may include a first pad D1 and a second pad D2. Thefirst pad D1 may be provided in plurality and connected to the datalines DL. The second pad D2 may be connected to the power supply patternVDD and electrically connected to the power supply line PL. The displaypanel 210 may provide the pixels PX with electrical signals providedfrom the outside through the display pads PDD. Meanwhile, the displaypads PDD may further include pads for receiving other electrical signalsaside from the first pad D1 and the second pad D2, but the exemplaryembodiments are not limited to any one embodiment.

FIG. 4 is a plan view of an input sensing part according to an exemplaryembodiment.

Referring to FIG. 4, an input sensing unit 220 may be disposed on adisplay panel 210. For example, the input sensing unit 220 may bedisposed directly on the display panel 210, or may also be coupled tothe display panel 210 through an adhesive member. When the input sensingunit 220 is formed by a continuous process after forming the displaypanel 210 (see FIG. 1B), the input sensing unit 220 may be referred toas an input sensing layer. In addition, when the input sensing unit 220is coupled to the display panel 210 through an adhesive member, theinput sensing unit 220 may be referred to as an input sensing panel.

The input sensing unit 220 includes a first sensing electrode TE1, asecond sensing electrode TE2, a plurality of sensing lines TL1, TL2, andTL3, and a plurality of sensing pads PDT.

The first sensing electrode TE1 and the second sensing electrode TE2 aredisposed in an active region AA. The input sensing unit 220 may acquireinformation about an external input TC (see FIG. 1A) through a change inthe electrostatic capacity between the first sensing electrode TE1 andthe second sensing electrode TE2.

The first sensing electrode TE1 may include first sensing patterns SP1and first connection patterns BP1. At least one first connection patternBP1 may be connected to two first sensing patterns SP1 adjacent to eachother. The second sensing electrode TE2 may include second sensingpatterns SP2 and second connection patterns BP2. At least one secondconnection pattern BP2 may be connected to two second sensing patternsSP2 adjacent to each other.

The sensing lines TL1, TL2, and TL3 are disposed in a peripheral regionNAA. The sensing lines TL1, TL2, and TL3 may include the first sensingline TL1, the second sensing line TL2, and the third sensing line TL3.

The first sensing line TL1 is connected to the first sensing electrodeTEl. The second sensing line TL2 is connected to one end of the secondsensing electrode TE2. The third sensing line TL3 is connected to theother end of the second sensing electrode TE2. The other end of thesecond sensing electrode TE2 may be a portion facing the one end of thesecond sensing electrode TE2.

According to an exemplary embodiment, the second sensing electrode TE2may be connected to the second sensing line TL2, and the third sensingline TL3. Accordingly, sensitivity may be uniformly maintained accordingto regions with respect to the second sensing electrode TE2 having arelatively larger length than the first sensing electrode TEl.Meanwhile, this is exemplarily illustrated, and the third sensing lineTL3 may be omitted, and the exemplary embodiments are not limited to anyone embodiment.

The sensing pads PDT are disposed on the peripheral region NAA. Thesensing pads PDT may include a first sensing pad Ti, a second sensingpad T2, and a third sensing pad T3. The first sensing pad T1 isconnected to the first sensing line TL1 and thereby electricallyconnected to the first sensing electrode TEL The second sensing pad T2is connected to the second sensing line TL2, and the third sensing padT3 is connected to the third sensing line TL3. Accordingly, the secondsensing pad T2 and the third sensing pad T3 are electrically connectedto the second sensing electrode TE2.

A portion of the input sensing unit 220 may be removed from the regioncorresponding to a sensing region SA. For example, a portion of thefirst sensing electrode TE1 and a portion of the second sensingelectrode TE2 may not be disposed in the sensing region SA. In thisembodiment, the first sensing electrode TE1 disposed to overlap thesensing region SA includes a first sensing pattern having a shape with aremoved portion, and the second sensing electrode TE2 may include asecond sensing pattern having a shape with a removed portion.

According to an exemplary embodiment, portions of the sensing electrodesTE1 and TE2 in the region overlapping the sensing region SA may beremoved, so that the problem may be prevented in which an electronicmodule 500 (see FIG. 1B) is occluded by the first sensing electrode TE1or the second sensing electrode TE2. Thus, the sensitivity of theelectronic module 500 may be improved.

FIG. 5 is a cross-sectional view of a display panel according to anexemplary embodiment. FIG. 6 is a cross-sectional view of a displaypanel according to an exemplary embodiment. FIG. 5 is a cross-sectionalview of a display panel 210 including a third region AR3 of a base layerBS, and FIG. 6 is a cross-sectional view of the display panel 210including a first region AR1 and a second region AR2 of the base layerBS.

Referring to FIGS. 5 and 6, a first insulating layer 10 is disposed onthe base layer BS. The first insulating layer 10 may include a barrierlayer 11 and a buffer layer 12.

The barrier layer 11 may include an inorganic material. The barrierlayer 11 may prevent oxygen or moisture introduced through the baselayer BS from penetrating into pixels PX (see FIG. 3). The buffer layer12 may include an inorganic material. The buffer layer 12 may providethe pixels PX with lower surface energy than the base layer BS so thatthe pixels PX may stably be formed on the base layer BS. FIG. 5illustrates each of the barrier layer 11 and the buffer layer 12 as asingle layer. However, this is exemplarily illustrated, and the barrierlayer 11 and the buffer layer 12 according to an exemplary embodimentmay be provided in plurality and also be alternately laminated with eachother. Alternatively, at least any one of the barrier layer 11 or thebuffer layer 12 may be provided in plurality and also be omitted.

Each of the pixels PX (see FIG. 3) may include a pixel circuit and alight-emitting element ELD. The pixel circuit may include transistorsTR, a capacitor, and the like. FIG. 5 illustrates only one transistorTR. The transistor TR may be the second transistor TR2 described in FIG.3.

The transistor TR may be disposed on the first insulating layer 10. Thetransistor TR includes a semiconductor pattern SP, a control electrodeCE, an input electrode IE, and an output electrode OE. The semiconductorpattern SP is disposed on the first insulating layer 10. Thesemiconductor pattern SP may include a semiconductor material. Thecontrol electrode CE spaced apart from the semiconductor pattern SP witha second insulating layer 20 disposed therebetween. The controlelectrode CE may be connected to the first transistor TR1 and oneelectrode of the capacitor CP which are described in FIG. 3.

The input electrode IE and the output electrode OE are spaced apart fromthe control electrode CE with a third insulating layer 30 and a fourthinsulating layer 40 disposed therebetween. The input electrode IE andthe output electrode OE pass through the second insulating layer 20, thethird insulating layer 30, and the fourth insulating layer 40 and areeach connected to one side and the other side of the semiconductorpattern SP.

An upper electrode UE may be disposed between the third insulating layer30 and the fourth insulating layer 40. The upper electrode UE may beconnected to the other electrode of the capacitor CP described in FIG.3.

A fifth insulating layer 50 is disposed on the fourth insulating layer40 and covers the input electrode IE and the output electrode OE. Thefourth insulating layer 40 may include an organic material and/or aninorganic material, and may have a single layer or a laminatedstructure.

A connection electrode CNE may be disposed on the fifth insulating layer50. The connection electrode CNE may be connected to the outputelectrode OE. A sixth insulating layer 60 may be disposed on theconnection electrode CNE.

The transistor TR according to an exemplary embodiment may be formed invarious structures, and the exemplary embodiments are not limited to theembodiment illustrated in FIG. 5.

The light-emitting element ELD is disposed on the sixth insulating layer60. The light-emitting element ELD may include a first electrode El, alight-emitting layer EL, and a second electrode E2. The first electrodeEl may pass through the sixth insulating layer 60 and be electricallyconnected to the transistor TR through the connection electrode CNE.

A seventh insulating layer 70 may be disposed on the sixth insulatinglayer 60. An opening is defined in the seventh insulating layer 70, andthe opening may expose at least a portion of the first electrode E1. Theseventh insulating layer 70 may be a pixel definition film.

The light-emitting layer EL may be disposed on the first electrode Elexposed by the opening defined in the seventh insulating layer 70. Thelight-emitting layer EL may include a light-emitting material. Forexample, the light-emitting layer may be composed of at least any one ofmaterials which emit red, green or blue light. The light-emitting layerEL may include a fluorescent material or a phosphorescent material. Thelight-emitting layer EL may include an organic light-emitting materialor an inorganic light-emitting material. The light-emitting layer EL mayemit light in response to a potential difference between the firstelectrode El and the second electrode E2.

The second electrode E2 may be disposed on the light-emitting layer EL.The second electrode E2 may have an integrated shape extending to aperipheral region NAA (see FIG. 3) from an active region AA (see FIG.3). The second electrode E2 may commonly be provided to the plurality ofpixels PX (see FIG. 3). Each light-emitting element ELD disposed on eachof the pixels PX receives a common second power supply voltage throughthe second electrode E2.

The second electrode E2 may include a transmissive conductive materialor a semi-transmissive conductive material. Accordingly, the lightgenerated from the light-emitting layer EL may easily be emitted in thethird direction DR3 through the second electrode E2. However, this isexemplarily illustrated, and the light-emitting element ELD according toan exemplary embodiment may be driven in a rear surface light-emittingtype in which the first electrode El includes a transmissive orsemi-transmissive material according to design, or also be driven in aboth surface light-emitting type in which light is emitted toward boththe front and rear surfaces, and the exemplary embodiments are notlimited to any one embodiment.

An eighth insulating layer 80 is disposed on the light-emitting elementELD and encapsulates the light-emitting element ELD. In this embodiment,the eighth insulating layer 80 may be an encapsulation layer. The eighthinsulating layer 80 may have an integrated shape extending to theperipheral region NAA (see FIG. 3) from the active region AA (see FIG.3). Meanwhile, although not shown, a capping layer which covers thesecond electrode E2 may further be disposed between the second electrodeE2 and the eighth insulating layer 80.

The eighth insulating layer 80 may include a first inorganic layer 81,an organic layer 82, and a second inorganic layer 83 which aresequentially laminated in the third direction DR3. In this embodiment,the first inorganic layer 81, the organic layer 82, and the secondinorganic layer 83 are each illustrated as a single layer. However, thisis exemplarily illustrated, and at least any one of the first inorganiclayer 81, the organic layer 82, and the second inorganic layer 83 may beprovided in plurality or be omitted, and the exemplary embodiments arenot limited to any one embodiment.

The first inorganic layer 81 may cover the second electrode E2. Thefirst inorganic layer 81 may prevent external moisture and oxygen frompenetrating into the light-emitting element ELD. For example, the firstinorganic layer 81 may include a silicon nitride, a silicon oxide, or acompound of combinations thereof. The first inorganic layer 81 may beformed through a deposition process.

The organic layer 82 may be disposed on the first inorganic layer 81 andcontact the first inorganic layer 81. The organic layer 82 may provide aflat surface on the first inorganic layer 81. Specifically, the organiclayer 82 may provide the active region AA with a flat surface.

Unevenness formed on the first inorganic layer 81, particles present onthe first inorganic layer 81, or the like may be covered by the organiclayer 82, and influences on the components, formed on the organic layer82, from the surface state of the upper surface of the first inorganiclayer 81 may be prevented. In addition, the organic layer 82 maymitigate stresses between contacting layers. The organic layer 82 mayinclude an organic material, and may be formed through a solutionprocesses such as spin coating, slit coating, or inkjet process.

The second inorganic layer 83 is disposed on the organic layer 82 andcovers the organic layer 82. The second inorganic layer 83 may be morestably formed on a relatively flat surface than on the first inorganiclayer 81. The second inorganic layer 83 encapsulates moisture etc.,discharged from the organic layer 82, and prevents moisture etc. fromflowing toward the outside. The second inorganic layer 83 may include asilicon nitride, a silicon oxide, or a compound of combinations thereof.The second inorganic layer 83 may be formed through a depositionprocess.

Referring to FIG. 6, groove parts GV1, GV2, and GV3 may be defined in afirst region AR1 of a base layer BS in the vicinity of a module hole MH.In addition, a dam part DMP may be disposed on the first region AR1 ofthe base layer BS.

Each of the groove parts GV1, GV2, and GV3 may be defined to be recessedfrom the upper surface of the base layer BS. Each of the groove partsGV1, GV2, and GV3 may be formed such that at least a portion of the baselayer BS is removed. Deposition patterns ELP may be disposed on each ofthe groove parts GV1, GV2, and GV3, and the deposition patterns ELP maybe covered by at least any one of the first inorganic layer 81 and thesecond inorganic layer 83.

A display panel 210 according to an exemplary embodiment furtherincludes the groove parts GV1, GV2, and GV3 and thereby blockscontinuity between the deposition pattern ELP and the light-emittingelements ELD. Accordingly, a penetration path of external moisture oroxygen is blocked, and the damage to the elements disposed in an activeregion AA (see FIG. 3) may be prevented.

In addition, the deposition pattern ELP disposed on each of the grooveparts GV1, GV2, and GV3 is covered by the first inorganic layer 81 orthe second inorganic layer 83, so that the influence to other elementsfrom the deposition pattern ELP may be prevented when manufacturing thedisplay panel 210. Thus, the process reliability of the display panel210 may be improved. Meanwhile, this is exemplarily illustrated, and inthe display panel 210 according to an exemplary embodiment, the grooveparts GV1, GV2, and GV3 may be provided as a single groove or omitted,and the exemplary embodiments are not limited to any one embodiment.

The groove parts GV1, GV2, and GV3 may be defined to be spaced apartfrom each other. The groove parts GV1, GV2, and GV3 are exemplarilyillustrated as the first to third groove parts GV1, GV2, and GV3 whichare formed to be spaced apart from a second region AR2 and sequentiallyformed in the direction approaching the module hole MH. Each of thefirst to third groove parts GV1, GV2, and GV3 may have a closed-lineshape surrounding the module hole MH, and may also have anintermittent-line shape surrounding at least a portion of the peripheryof the module hole MH, and the exemplary embodiments are not limited toany one embodiment.

The dam part DMP is disposed on the first region AR1, so that theformation region of the organic layer 82 is defined within apredetermined region and additional expansion of the organic layer 82 isprevented. The dam part DMP may be provided in plurality and disposedbetween groove parts GV1, GV2, and GV3. The dam part DMP is illustratedas a laminating structure including first to third layers P11, P12, andP13. However, this is only an example, the dam part DMP may also have asingle layer structure, and the exemplary embodiments are not limited toany one embodiment.

A cover layer FL may be disposed on the first region AR1. For example,the cover layer FL may cover a non-flat surface formed by the dam partDMP or the groove parts GV1, GV2, and GV3 to provide a flat surfaceFL_SH. The flat surface FL_SH defined by the cover layer FL may define aplane substantially the same as a flat surface 80_S substantiallydefined by the eighth insulating layer 80.

The display panel 210 may further include a metal pattern MTL. The metalpattern MTL may be disposed on the first region AR1. The metal patternMTL may be disposed along the periphery of the module hole MH and coverat least a portion of the cover layer FL. The metal pattern MTL mayprevent the cover layer FL from being damaged by laser or the like whenthe module hole MH is formed. In addition, the metal pattern MTL maypress the cover layer FL to thereby prevent the phenomenon in which thecover layer FL floats.

Signal lines SLa, SLb, SLc, and SLd may be disposed on the second regionAR2 of the base layer BS. The signal lines SLa, SLb, SLc, and SLd mayinclude the first line SLa, the second line SLb, the third line SLc, andthe fourth line SLd. Some of the signal lines SLa, SLb, SLc, and SLd maybe scan lines GL (see FIG. 3) and the others may be data lines DL (seeFIG. 3). For example, the first line SLa and the second line SLb may bethe scan lines GL, and the third line SLc and the fourth line SLd may bethe data lines DL.

The first line SLa may be disposed between the second insulating layer20 and the third insulating layer 30. The first line SLa may be disposedon the same layer as the control electrode CE. The second line SLb maybe disposed between the third insulating layer 30 and the fourthinsulating layer 40. The second line SLb may be disposed on the samelayer as the upper electrode UE. The third line SLc may be disposedbetween the fourth insulating layer 40 and the fifth insulating layer50. The third line SLc may be disposed on the same layer as the outputelectrode OE and the input electrode IE. The fourth line SLd may bedisposed between the fifth insulating layer 50 and the sixth insulatinglayer 60. The fourth line SLd may be disposed on the same layer as theconnection electrode CNE.

FIG. 7 is a cross-sectional view of a display panel according to anexemplary embodiment. FIG. 7 is a cross-sectional view of a displaypanel 210-1 including a first region AR1 and a second region AR2 of abase layer BS. In describing FIG. 7, portions having difference fromFIG. 6 will be described, and the same components as the componentsdescribed in FIG. 6 are referred to by the same reference symbols andthe overlapping description will not be provided.

Referring to FIG. 7, a display panel 210-1 may include a base layer BS-1and an encapsulation substrate 80-1.

The encapsulation substrate 80-1 may be disposed on a second electrodeE2. The encapsulation substrate 80-1 and the second electrode E2 may bespaced apart from each other. A space GAP between the encapsulationsubstrate 80-1 and the second electrode E2 may be filled with air or aninactive gas. In addition, in an exemplary embodiment, the space GAP mayalso be filled with filling material such as a silicon-based polymer, anepoxy-based resin, or an acrylic resin.

The encapsulation substrate 80-1 may be coupled the base layer BS-1through a sealing member PSL. The encapsulation substrate 80-1 may bedisposed on the base layer BS-1 while maintaining a predetermined gapthrough the sealing member PSL.

The sealing member PSL may be a component which defines the innersurface of a module hole MH. The sealing member PSL may include anorganic material such as a photocurable resin thermoplastic resin, orinorganic material such as a frit seal, and the exemplary embodimentsare not limited to any one embodiment.

FIG. 8 is an enlarged plan view illustrating the region XX′ shown inFIG. 3.

Referring to FIG. 8, a base layer BS may include a first region AR1, asecond region AR2, and a third region AR3. A module hole MH may bedefined within the first region AR1. Accordingly, the first region AR1may surround the peripheral portion of the module hole MH. The secondregion AR2 may surround the first region AR1. The third region AR3 maysurround the second region AR2.

On the second region AR2 and the third region AR3, first signal lineparts SLP1 and second signal line parts SLP2 may be disposed. Lines,among data lines DL, passing over the second region AR2 may be referredto as the first signal line parts SLP1, and lines, among scan lines GL,passing over the second region AR2 may be referred to as the secondsignal line parts SLP2. That is, each of the first signal line partsSLP1 and the second signal line parts SLP2 may be respectively disposedon the second region AR2 and the third region AR3.

The first signal line parts SLP1 may be arrayed in the first directionDR1 so as to be spaced apart from each other, and the second signal lineparts SLP2 may be arrayed in the second direction DR2 so as to be spacedapart from each other.

A boundary BD between the first region AR1 and the second region AR2 mayhave a circular shape. Portions of each of the first signal line partsSLP1 and the second signal line parts SLP2, the portions being disposedon the second region AR2 may extend corresponding to the shape of theboundary BD.

Each of the first signal line parts SLP1 may include a first connectionpart CEP1, and each of the second signal line parts SLP2 may include asecond connection part CEP2. The first connection part CEP1 and thesecond connection part CEP2 may reduce amounts of charges accumulated oneach of the first signal line parts SLP1 and second signal line partsSLP2. Thus, during an electrostatic discharge test, a peak currentoccurring in the first signal line parts SLP1 and second signal lineparts SLP2 may be reduced. Therefore, the possibility of causingelectrical damage to a display panel 210 (see FIG. 3) may be reduced.

Each of the first connection part CEP1 and the second connection partCEP2 may be provided in plurality. A portion of the first connectionparts CEP1 may be disposed on the second region AR2 and the otherportion may be disposed on the third region AR3. In addition, a portionof the second connection parts CEP2 may be disposed on the second regionAR2, and the other portion may be disposed on the third region AR3.According to an exemplary embodiment, since a portion of the firstconnection parts CEP1 and a portion of the second connection parts CEP2are disposed on the second region AR2, the area of a dead space aroundthe module hole MH may be reduced. The dead space may include a portionof the second region AR2 and the third region AR3. For example, aportion of the third region AR3 may be a region in which a pixel PX isnot disposed.

The pixel PX may be provided in plurality, and hereinafter referred toas pixels PX.

One pixel among the pixels PX may be electrically connected to one scanline GL and one data line DL. Another pixel PX among the pixels PX maybe electrically connected to one scan line GL and one of the firstsignal line parts SLP1. Still another pixel PX among the pixels PX maybe electrically connected to one data line DL and one of the secondsignal line parts SLP2. Yet another pixel PX among the pixels PX may beelectrically connected to one of the first signal line parts SLP1 andone of the second signal line parts SLP2.

FIG. 9 is a view of a captured image of a region corresponding to regionYY′ shown in FIG. 8.

Referring to FIGS. 3 and 9, a third region AR3 may include a majorregion MAA and a peripheral region PAA. A Pixel PX may be disposed onthe major region MAA, and a pixel PX may not disposed on the peripheralregion PAA, and the first connection parts CEP1 and the secondconnection parts CEP2 (see FIG. 8) may be disposed on the peripheralregion PAA. The peripheral region PAA and one region of a display panel210 corresponding to a second region AR2 are regions in which no imageis displayed and may be defined as a dead space.

According to an exemplary embodiment, since a portion of the firstconnection parts CEP1 and a portion of the second connection parts CEP2are disposed on the second region AR2, the width of the peripheralregion PAA may be reduced. Accordingly, the area of the dead space maybe reduced.

FIG. 10 is a schematic plan view illustrating a region corresponding toregion ZZ′ of FIG. 9. FIG. 11 is a cross-sectional view taken along asectional line I-I′ of FIG. 10, and FIG. 12 is a cross-sectional viewtaken along a sectional line II-II′ of FIG. 10. For convenience ofdescription, some components are omitted in FIGS. 10, 11, and 12.

Referring to FIGS. 8, 9, 10, 11, and 12, the first signal line partsSLP1 may be divided into a first signal line part SLP1 a and a firstsignal line part SLP1 b. Each of the first signal line part SLP1 a andthe first signal line part SLP1 b may be provided in plurality, and thefirst signal line part SLP1 a and the first signal line part SLP1 b maybe alternately arrayed in the first direction DR1.

The first signal line part SLP1 a may include a first line LN1 a, asecond line LN2 a, and a first connection part CEP1 a. The first lineLN1 a and the second line LN2 a may be spaced apart from each other. Thefirst line LN1 a and the second line LN2 a may not be directly connectedto each other. The wording “not directly connected” may mean “not indirect contact with”. The first line LN1 a and the second line LN2 a maybe electrically connected to each other through the first connectionpart CEP1 a.

FIG. 11 may correspond to the cross-sectional view of the first signalline part SLP1 a. The first line LN1 a and the second line LN2 a may bedisposed on the same layer as each other. For example, the first lineLN1 a and the second line LN2 a may be disposed between the fourthinsulating layer 40 and the fifth insulating layer 50. That is, thefirst line LN1 a and the second line LN2 a may constitute the third lineSLc illustrated in FIG. 6.

The first connection part CEP1 a may be disposed on a fifth insulatinglayer 50. The first connection part CEP1 a may pass through the fifthinsulating layer 50 and be connected to each of the first line LN1 a andthe second line LN2 a.

The first signal line part SLP1 b may include a first line LN1 b, asecond line LN2 b, and a first connection part CEP1 b. The first lineLN1 b and the second line LN2 b may be spaced apart from each other andbe disposed on layers different from each other. The first line LN1 band the second line LN2 b may be electrically connected to each otherthrough the first connection part CEP1 b.

FIG. 12 may correspond to the cross-sectional view of the first signalline part SLP1 b. The first line LN1 b may be disposed between the fifthinsulating layer 50 and the sixth insulating layer 60, and the secondline LN2 b may be disposed between the fourth insulating layer 40 andthe fifth insulating layer 50. The first line LN1 b may constitute thefourth line SLd shown in FIG. 6, and the second line LN2 b mayconstitute the third line SLc shown in FIG. 6.

The first connection part CEP lb may be disposed on the same layer asthe first line LN1 b, and may extend from the first line LN1 b. Inanother exemplary embodiment, the first connection part CEP lb may bedisposed on the same layer as the second line LN2 b, and may extend fromthe second line LN2 b. The first signal line part SLP1 b may furtherinclude a dummy pattern D-LN2 b. The dummy pattern D-LN2 b may bedisposed on the same layer as the second line LN2 b. The dummy patternD-LN2 b may be electrically connected to the first connection part CEP1b. In addition, in another exemplary embodiment, the dummy pattern D-LN2b may be omitted or also be connected to the second line LN2b.

Referring again to FIG. 10, the connection parts CEP1 a and CEP lb maybe disposed so as to be spaced apart from each other in the firstdirection DR1. At least three most adjacent first connection parts CEP1a and CEP lb among the first connection parts CEP1 a and CEP1 b mayoverlap each other in the first direction DR1.

In addition, a portion of the first connection parts CEP1 a and CEP lbmay be divided into overlapped connection part CEP-O and the otherportion may be divided into non-overlapped connection part CEP-NO. Atleast a portion of the overlapped connection part CEP-O may overlap thesecond region AR2. The overlapped connection part CEP-O may overlap atleast a portion of the second signal line parts SLP2. The non-overlappedconnection part CEP-NO may not overlap the second region AR2. That is,the non-overlapped connection part CEP-NO may be disposed on the thirdregion AR3.

Each of the overlapped connection part CEP-O and the non-overlappedconnection part CEP-NO may be provided in plurality and each of theoverlapped connection part CEP-O and the non-overlapped connection partCEP-NO may be arrayed so as to be spaced apart from each other in thefirst direction DR1.

FIG. 13 is an enlarged plan view illustrating region KK′ shown in FIG.8. FIG. 14 is a cross-sectional view taken along a sectional line ofFIG. 13.

Referring to FIGS. 13 and 14, the second signal line parts SLP2 may bedivided into a second signal line part SLP2 a and a second signal linepart SLP2 b. Each of the second signal line part SLP2 a and the secondsignal line part SLP2 b may be provided in plurality and may be arrayedso as to be alternately arrayed in the second direction DR2.

The second signal line part SLP2 a may include a third line LN3 a, afourth line LN4 a, and a second connection part CEP2 a. The third lineLN3 a and the fourth line LN4 a may be spaced apart from each other. Thethird line LN3 a and the fourth line LN4 a may not be directly connectedto each other. The second signal line part SLP2 b may include a thirdline LN3 b, a fourth line LN4 b, and a second connection part CEP2 b.The third line LN3 b and the fourth line LN4 b may be spaced apart fromeach other. The third line LN3 b and the fourth line LN4 b may not bedirectly connected to each other.

The third line LN3 a may be disposed between the third insulating layer30 and the fourth insulating layer 40, and may constitute the secondline SLb described in FIG. 6. The fourth line LN4 a may be disposedbetween the second insulating layer 20 and the third insulating layer30, and may constitute the first line SLa described in FIG. 6. The thirdline LN3 b may constitute the first line SLa, and the fourth line LN4 bmay constitute the second line SLb. When viewed in a plan view, thesecond connection parts CEP2 a and CEP2 b may overlap the first signalline parts SLP1.

FIG. 15 is a view of a captured image of a region corresponding to theregion YY′ shown in FIG. 8. FIG. 16 is a schematic plan viewillustrating a region corresponding to region LL′ of FIG. 15.

Referring to FIGS. 15 and 16, a portion of the first connection partsCEP1 a and CEP lb may be divided into overlapped connection part CEP-Oand the other portion may be divided into non-overlapped connection partCEP-NO. The overlapped connection part CEP-O may overlap the secondregion AR2. The overlapped connection part CEP-O may overlap at least aportion of the second signal line parts SLP2. The non-overlappedconnection part CEP-NO may not overlap the second region AR2. That is,the non-overlapped connection part CEP-NO may be disposed on the thirdregion AR3.

Unevenness may be caused by the second signal line parts SLP2 on thesurface on which the overlapped connection parts CEP-O is disposed.Residues may remain in the unevenness while the overlapped connectionparts CEP-O are formed. The overlapped connection parts CEP-O adjacentto each other may be connected to each other by the residues, and thismay cause an operational defect of the display panel 210.

According to an exemplary embodiment, each of the overlapped connectionpart CEP-O and the non-overlapped connection part CEP-NO may be providedin plurality. The non-overlapped connection parts CEP-NO may be arrayedwhile being spaced apart from each other in the first direction DR1. Theoverlapped connection parts CEP-O may be arrayed zigzag with respect toa virtual line extending in the first direction DR1. That is, theoverlapped connection parts CEP-O may not be disposed continuously in apredetermined direction. For example, two adjacent overlapped connectionparts CEP-O1 and CEP-O2 among the overlapped connection parts CEP-O maynot overlap each other when viewed in the first direction DR1.Accordingly, the probability that the two overlapped connection partsCEP-O1 and CEP-O2 are connected to each other by the residues may bereduced.

For example, the widths of the overlapped connection parts CEP-O 1 andCEP-O2 are larger than the width of the first lines LN1 a and LN1 b andthe widths of the second lines LN2 a and LN2 b. The widths mean thewidths in the first direction DR1. According to an exemplary embodiment,the overlapped connection parts CEP-O1 and CEP-O2 are not disposedcontinuously in the first direction DR1. Accordingly, the distancebetween the first signal line parts SLP1 a and SLP1 b adjacent to eachother may be increased. Thus, the phenomenon, in which the first signalline parts SLP1 a and SLP1 b adjacent to each other are shorted witheach other, may be prevented.

In an exemplary embodiment, at least a portion of each of the twoadjacent overlapped connection parts CEP-O1 and CEP-O2 among theoverlapped connection parts CEP-O may not overlap each other when viewedin the first direction DR1. That is, at least the other portion of thetwo adjacent overlapped connection parts CEP-O1 and CEP-O2 may overlapeach other when viewed in the first direction DR1. In this case, sincethe centers of the overlapped connection parts CEP-O are not disposed onthe same line, for example, in a line extending in the first directionDR1, the probability that the overlapped connection parts CEP-O areconnected by residues may be reduced.

FIG. 17 is an enlarged plan view illustrating the region XX′ shown inFIG. 3. FIG. 18 is a view in which a region corresponding to region MM′of FIG. 17 is imaged. FIG. 19 a schematic plan view illustrating aregion corresponding to region NN′ of FIG. 18.

Referring to FIGS. 17, 18, and 19, when comparing with FIG. 8, thepositions of the first connection parts CEP1 and the second connectionparts CEP2 are different.

The first connection parts CEP1 may not overlap the second signal lineparts SLP2, and the second connection parts CEP2 may not overlap thefirst signal line parts SLP2.

For example, each of the first connection parts CEP1 and the secondconnection parts CEP2 may not be disposed on the second region AR2, butdisposed on the third region AR3. FIG. 20 is an exploded perspectiveview of a display device according to an exemplary embodiment. Indescribing FIG. 20, portions having difference from FIG. 1B will bedescribed, and the same components as the components described in FIG.1B are referred to by the same reference symbols and the overlappingdescription will not be provided.

Referring to FIG. 20, a display device EA-T may include a window 100, adisplay module 200-T, a drive circuit part 300-T, a housing 400, and anelectronic module 500.

The drive circuit part 300-T may include a main circuit board MB and aflexible film CF. The display module 200-T may be divided into a firstmodule region MD1, a second module region MD2, and a third module regionMD3. The first module region MD1 may be a region corresponding to thefirst region AR1 of the base layer BS shown in FIG. 3, the second moduleregion MD2 may be a region corresponding to the second region AR2 of thebase layer BS, and the third module region MD3 may be a regioncorresponding to the third region AR3 of the base layer BS.

The first module region MD1 may be a region overlapping the electronicmodule 500 when viewed in a plan view. The transmittance of the firstmodule region MD1 may be higher than the transmittance of the thirdmodule region MD3. In order to raise the transmittance of the firstmodule region MD1, predetermined components may not be disposed in thefirst module region MD1. For example, an avoidance design may beperformed so that at least a portion of the signal lines GL, DL, and PL(see FIG. 3) may not overlap the first module region MD1. In addition,at least a portion of the components constituting the display module200-T may not be disposed in the first module region MD1. For example,in the first module region MD1, at least one of the first electrode El(see FIG. 5), the second electrode E2 (see FIG. 5), the light-emittingelement ELD (see FIG. 5), the transistor TR (see FIG. 5), the firstsensing electrode TE1 (see FIG. 4), or the second sensing electrode TE2(see FIG. 4) may not be disposed.

Thus, the electronic module 500 disposed to overlap the first moduleregion MD1 may easily view an external subject through the first moduleregion MD1, or an output signal generated by the electronic module 500may easily be transmitted to the outside.

A display device according to an exemplary embodiment may include a baselayer, first signal line parts, and second signal line parts. The baselayer may include a first region in which the first signal line partsand the second signal line parts are not disposed, a second regionsurrounding the first region, and a third region surrounding the secondregion. The first signal line parts may include first connection parts.A portion of the first connection parts may overlap the second signalline parts disposed on the second region. Accordingly, the area of adead space around the first region may be reduced. In addition, thefirst connection parts overlapping the second region may not becontinuously disposed in a predetermined direction. Thus, the firstsignal line parts adjacent to each other may be prevented from beingshorted with each other.

Although certain exemplary embodiments and implementations have beendescribed herein, other embodiments and modifications will be apparentfrom this description. Accordingly, the inventive concepts are notlimited to such embodiments, but rather to the broader scope of theappended claims and various obvious modifications and equivalentarrangements as would be apparent to a person of ordinary skill in theart.

What is claimed is:
 1. A display device comprising: a base layercomprising a first region in which a hole is defined, a second regionsurrounding the first region, and a third region surrounding the secondregion; pixels disposed on the third region of the base layer; scanlines electrically connected to at least some of the pixels and disposedon the first and second regions of the base layer; and data lineselectrically connected to at least some of the pixels and disposed onthe first and second regions of the base layer, wherein: each of thepixels comprises a pixel circuit including a transistor and a capacitor,a light emitting element, and a connection electrode connecting thepixel circuit and the light emitting element, the capacitor comprises afirst electrode disposed on a first layer and a second electrodedisposed on a second layer over the first layer, the transistorcomprises a control electrode disposed on the first layer, and an inputand output electrodes disposed on a third layer over the second layer,the connecting electrode disposed on a fourth layer over the thirdlayer, the scan lines comprise first line portions disposed on thesecond region of the base layer and second line portions disposed on thethird region of the base layer, the data lines comprise third lineportions disposed on the second region of the base layer, fourth lineportions disposed on the third region of the base layer, and connectionportions connecting the third line portions and the fourth lineportions, respectively, some of the first line portions are disposed onthe first layer, and others of the first line portions are disposed onthe second layer, some of the third line portions are disposed on thethird layer, and others of the third line portions are disposed on thefourth layer, the connection portions comprise first connection portionsarranged in a first direction and second connection portions arranged inthe first direction, and the first connection portions and the secondconnection portions are spaced apart from each other in a seconddirection crossing the first direction, when viewed from the firstdirection.
 2. The display device of claim 1, wherein the connectionportions are disposed on the fourth layer.
 3. The display device ofclaim 1, wherein the fourth line portions are disposed on the thirdlayer.
 4. The display device of claim 1, wherein each of the first andthird line portions has a shape surrounding at least a portion of thehole.
 5. The display device of claim 1, wherein a portion of each of thefirst and third line portions is curved line.
 6. The display device ofclaim 1, wherein each of the second and fourth line portions is straightline.
 7. The display device of claim 1, further comprising a damdisposed on the base layer and surrounding at least a portion of thehole.
 8. The display device of claim 7, wherein the first and third lineportions do not overlap the dam, when viewed in a plan view, and whereinthe first and third line portions are spaced apart from the hole withthe dam therebetween, when viewed in a plan view.
 9. The display deviceof claim 7, wherein the dam is provided in plurality, and the dams arearranged to be spaced apart from each other.
 10. The display device ofclaim 7, wherein the dam has a single-layer structure or a multilayerstructure including a plurality of layers.
 11. The display device ofclaim 1, wherein some of the first connection portions do not overlapthe first and third line portions, and other of the first connectionportions overlap the first and third line portions.
 12. The displaydevice of claim 11, wherein some of the second connection portions donot overlap the first and third line portions, and other of the secondconnection portions overlap the first and third line portions.
 13. Thedisplay device of claim 11, wherein the connection portions do notoverlap the first and third line portions.
 14. The display device ofclaim 11, wherein a third line portion among the third line portionsdisposed on the third layer and a fourth line portion among the fourthline portions disposed on the third layer are spaced apart from eachother and the third line portion and the fourth line portionelectrically connected by a connection portion among the connectionportions.
 15. The display device of claim 1, wherein a number of thefirst connection portions is greater than a number of the secondconnection portions.
 16. The display device of claim 1, wherein thesecond connection portions are closer to the hole than the firstconnection portions, when viewed from the first direction.
 17. Thedisplay device of claim 1, wherein each of the scan lines comprises afirst line portion of the first line portions and a second line portionof the second line portions electrically connected to the first lineportion, and wherein each of the data lines comprises a third lineportion of the third line portions and a fourth line portion of thefourth line portions electrically connected to the third line portion.18. The display device of claim 1, further comprising: normal scan linesdisposed on the third region and non-overlapping with the second region,and normal data lines disposed on the third region and non-overlappingwith the second region.
 19. The display device of claim 1, wherein thefirst layer, the second layer, the third layer, and the fourth layer aredefined along a direction away from the base layer.
 20. The displaydevice of claim 1, wherein the connection portions comprise anintegrally connecting portion extending from a third line portion amongthe third line portions disposed on the fourth layer and having a shapeintegral with the third line portion, and an independent connectionportion in contact with a third line portion among the third lineportions disposed on the third layer.